We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Joining Services.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

Joining Services Product List and Ranking from 4 Manufacturers, Suppliers and Companies

Joining Services Product List

1～5 item / All 5 items

Displayed results
Metal cladding bonding services

Metal cladding bonding services

Numerous manufacturing achievements, such as secondary terminals of mold transformers and cathode electrodes of zinc refining electrolytic cells!

Our company provides cladding (explosive bonding) services for dissimilar metals such as copper and aluminum, as well as copper and stainless steel. We manufacture a variety of functional materials for application development, including full circumference cladding connections of dissimilar metals and thin plate cladding of dissimilar metals. Additionally, we specialize in metal surface strengthening and modification technologies, achieving strength in the screw and seal areas comparable to that of iron. 【Manufacturing Achievements】 ■ Secondary terminals for molded transformers, etc. ■ Compression terminals for aluminum transmission lines ■ Cathode electrodes for zinc refining electrolytic cells, etc. *For more details, please download the PDF or feel free to contact us.

  • stainless
  • Non-ferrous metals
  • Other metal materials

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Low melting point soldering service

Low melting point soldering service

Joining services using low melting point solder such as indium (In) and tin (Sn). We also accept inquiries for prototypes.

The solder materials used for joining metals and ceramics, such as sputtering targets and electrostatic chucks, typically consist of low melting point metals like indium. In response to customer requests to match the solder materials to the temperature range of use, we have developed specialized solder materials to provide optimal solutions for specific purposes and applications. <Features> By alloying materials from indium (melting point 156°C) to materials with melting points up to 1000°C, and if the compatibility between the target material and the alloy solder is poor, we propose the optimal joining method for each material and shape by combining surface treatment through sputtering deposition. <Target Markets> Electronics, materials, chemicals, energy sectors, and others.

  • Other metal materials

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Kubo Metal Co., Ltd. Aluminum Soldering Service

Kubo Metal Co., Ltd. Aluminum Soldering Service

Aluminum joining technology: Aluminum soldering has become easier.

This technology is not limited to radiators and is considered applicable in a wide range of areas. We hope that it will be extensively considered in your company's and your profession's designs.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Smooth copper foil / low dielectric material bonding service

Smooth copper foil / low dielectric material bonding service

Joining of inorganic and organic materials using molecular adhesives.

Our company specializes in the bonding of smooth copper foil and low dielectric materials. This is suitable for high-frequency substrates required in the ICT market and can be adapted to low dielectric resins (such as LCP and PPE). Please feel free to consult us if you have any requests. 【Features】 ■ Bonding of smooth copper foil is possible → Reduction of conductor loss ■ Bonding with low dielectric materials is possible → Reduction of dielectric loss ■ Bonding through chemical bonding → Improved heat resistance and durability *For more details, please download the PDF or feel free to contact us.

  • Other services
  • Other contract services

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Dissimilar material joining service

Dissimilar material joining service

A new bonding method for different materials!

Our company specializes in the bonding of dissimilar materials using molecular adhesives. One of the features of these compounds, known as molecular adhesives, is that they connect materials through chemical bonds, allowing for sufficient adhesion even when the material surfaces are flat. Additionally, even if the materials being bonded are different, the surfaces can be treated to have the properties of the molecular adhesive, making it possible to bond difficult-to-adhere materials. Please feel free to consult us if you have any requests. 【Features of Molecular Bonding Technology】 ■ Bonding of dissimilar materials ■ Adhesion even with flat surfaces *For more details, please download the PDF or feel free to contact us.

  • Other services
  • Other contract services

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
COPYRIGHT © 2001-2025 IPROS CORPORATION ALL RIGHTS RESERVED.